Non-Enzymatic Glucose Sensors Based on Nickel Nanoporous Thin Films Prepared by Physical Vapor Deposition at Oblique Angles for Beverage Industry Applications

Nickel nanoporous thin films deposited on Indium tin oxide conductive plates have been prepared by physical vapor deposition in an oblique angle configuration. The scanning electron microscopy characterization of these films revealed a microstructure formed by tilted nanocolumns of ca. 40-60 nm of diameter inclined by ca. 26 degrees with respect to the normal. These…

Effect of Nickel and Magnesium on the Electrochemical Behavior of AA 1050 Alloys in Nitric Acid Solution

The study investigates the influence of nickel and magnesium additions to AA 1050 aluminum alloy on the electrochemical behavior of the alloy in nitric acid solution under conditions relevant to the lithographic and electronic industries. Magnesium and nickel additions are of interest, since they can improve the alloy properties for the printing process by improving…

The Use of Fluorocarbons to Mitigate the Oxygen Dependence of Glucose Microbiosensors for Neuroscience Applications

First-generation amperometric glucose biosensors are the most commonly used method for glucose monitoring in neuroscience. Nevertheless, biosensors of this genre suffer from the so-called «oxygen deficit». This problem is particularly acute when the oxygen concentration is low, as is the case in brain extracellular fluid. In the present work we use different fluorocarbons, such as…

Modeling Macro-Sized, High Aspect Ratio Through-Hole Filling by Multi-Component Additive-Assisted Copper Electrodeposition

A multi-element, time-dependent model is used to examine additive-assisted copper electroplating in macro-channels. This model is an adaptation of the work of Akolkar and Landau [J. Electrochem. Soc., 156, D351 (2009)], used to describe plating in micro-vias for integrated circuits. Using their method for describing species movement in the channel, the model has been expanded…

Modeling Macro-Sized, High Aspect Ratio Through-Hole Filling by Multi-Component Additive-Assisted Copper Electrodeposition

A multi-element, time-dependent model is used to examine additive-assisted copper electroplating in macro-channels. This model is an adaptation of the work of Akolkar and Landau [J. Electrochem. Soc., 156, D351 (2009)], used to describe plating in micro-vias for integrated circuits. Using their method for describing species movement in the channel, the model has been expanded…