Interfacial characterization of silicon nitride/silicon nitride joints brazed using Cu-base active metal interlayers

Silicon nitride/silicon nitride joints were vacuum brazed at 1317 K for 5 min and 30 min using ductile Cu-base active metal interlayers. The joints were characterized using scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), electron back scattered diffraction (EBSD), and transmission electron microscopy (TEM). An inhomogeneous Ti-rich reaction layer (similar to 2-3 mu m…